Physical Intelligence

Bonding methods for modular micro-robotic assemblies

2013

Conference Paper

pi

Author(s): Diller, Eric and Zhang, Naicheng and Sitti, Metin
Book Title: Robotics and Automation (ICRA), 2013 IEEE International Conference on
Pages: 2588--2593
Year: 2013
Department(s): Physical Intelligence
Bibtex Type: Conference Paper (inproceedings)
Organization: IEEE

BibTex 

@inproceedings{diller2013bonding,
  title = {Bonding methods for modular micro-robotic assemblies},
  author = {Diller, Eric and Zhang, Naicheng and Sitti, Metin},
  booktitle = {Robotics and Automation (ICRA), 2013 IEEE International Conference on},
  pages = {2588--2593},
  organization = {IEEE},
  year = {2013},
  doi = {}
}